name : Semiconductor Equipment Plating

For partial nickel/gold plating on specific parts of semiconductor equipment, brush plating/spray plating technology can significantly reduce the shielding problem of traditional tank plating.

Various cavities require partial nickel plating on the end surface.

Introduction

Introduction

  • Semiconductor Equipment Plating
    Partial nickel-plating on the upper edge of aluminum alloy vacuum chamber.
  • Semiconductor Equipment Plating
    Partial nickel-plating on the inner bottom of aluminum alloy vacuum chamber.
  • Semiconductor Equipment Plating
    Partial nickel-plating on the side of large chamber.
  • Semiconductor Equipment Plating
    Rounded partial nickel plating.
  • Semiconductor Equipment Plating
    Partial nickel-plating on the upper inner side of large chamber.
  • Semiconductor Equipment Plating
    Partial nickel-plating on the alloy aluminum chamber.
  • Semiconductor Equipment Plating
    Original aluminum alloy cavity (Left) Partial nickel-plated finished product (Right)